dc C 26.5 ghz spdt gaas mmic switch technical data HMMC-2027 features ? outputs terminated in 50 w when off ? frequency range: dc- 26.5 ghz ? insertion loss: 2.5db @ 26.5 ghz ? isolation: >70 db @ 45 mhz 30 db @ 26.5 ghz ? return loss: 15 db (both input and selected output) 12 db unselected output ? switching speed: <1 ns (10%-90% rf) ?p -1db : 18 dbm @ 10 mhz 27 dbm @ 2 ghz ? harmonics (dc coupled): <-45 dbc @ 10 mhz and 5 dbm <-65 dbc @ 2 ghz and 5 dbm description the HMMC-2027 is a gaas monolithic microwave integrated circuit (mmic) designed for low insertion loss and high isolation from dc to 26.5 ghz. it is intended for use as a general- purpose, single-pole, double- throw (spdt), absorptive switch. two series and two shunt mesfets per throw provide 3 db maximum insertion loss and 30 db minimum isolation at 26.5 ghz. HMMC-2027 chips use through-substrate vias to provide ground connections to the chip backside and minimize the number of wire bonds required. chip size: 900 x 960 m m (35.4 x 37.8 mils) chip size tolerance: 10 m m ( 0.4 mils) chip thickness: 127 15 m m (5.0 0.6 mils) pad dimensions: 80 x 80 m m (3.2 x 3.2 mils), or larger absolute maximum ratings [1] symbol parameters/conditions units min. max. v sel select voltages 1 and 2 v -10.5 +3 p in rf input power dbm 25 t op operating temperature c -55 +125 t stg storage temperature c -65 +165 t max maximum assembly temp. c +200 p unsel [2] power into unselected output dbm 15 notes: 1. operation in excess of any one of these conditions may result in permanent damage to this device. t a = 25 c except for t op , t stg , and t max . 2. operation in excess of these @ t op-max may result in permanent damage. rf in rf out2 chip id rf out1 sel1 sel2
2 dc specifications/physical properties, t a = 25 c symbol parameters and test conditions units min. typ. max. i l leakage current @ -10 v m a 200 pinch-off voltage (v sel2 = v p , v rfout2 = +2 v, v p i rfout2 = 2 ma, v sel1 = -10 v, v rfout1 = open circuit, v -6.75 -3.00 v rfin = gnd bv gss breakdown voltage (test fet w/v d = v s = gnd, i g = -50 m a) v -13.0 rf specifications, t a = 25 c, z o = 50 w , v sel-high = 0 v, v sel-low = -10 v symbol parameters and test conditions units min. typ. max. bw guaranteed operating bandwidth ghz dc 26.5 il insertion loss, rf in to selected rf out ,f = 26.5 ghz, on throw db 2.5 3.0 iso isolation, rf in to unselected rf out ,f = 26.5 ghz, off throw db 27 30 iso isolation, rf in to unselected rf out , f = 18 ghz, off throw db 40 43 rl in input return loss db 12 15 rl out-on output return loss, on throw db 13 16 rl out-off output return loss, off throw db 9 12 p 1 db input power where il increases by 1 db f in = 2 ghz dbm 27 t s switching speed, 10% C 90% rf envelope f in = 2 ghz ns 1
3 applications the HMMC-2027 can be used in instrumentation, communica- tions, radar, ecm, ew, and many other systems requiring spdt switching. it can be used for pulse modulation, port isolation, transfer switching, high-speed switching, replacement of mechanical switches, and so on. assembly techniques die attach should be done with conductive epoxy. gold thermosonic bonding is recom- mended for all bonds. the top and bottom metallization is gold. for more detailed information see agilent application note #999, gaas mmic assembly and handling guidelines. gaas mmics are esd sensitive. proper precautions should be used when handling these devices. s-parameters [1] , t a =25 c, z o = 50 w , v sel high = 0 v, v sel low = -10 v freq. s 11 s 21 s 31 s 22 s 33 ghz (insertion loss) (isolation) (on throw) (off throw) db mag. ang. db mag. ang. db db mag. ang. db mag. ang. 0.5 -26.41 0.048 -57.11 -1.08 0.88 -49.06 -67.74 -28.40 0.03 -47.94 -32.26 0.024 47.18 0.5 -18.28 0.12 -7.04 -1.33 0.86 -8.52 -71.40 -18.44 0.12 -9.89 -16.79 0.14 173.87 1.5 -18.53 0.12 -13.70 -1.35 0.86 -14.62 -61.02 -18.46 0.12 -19.75 -16.47 0.15 171.75 4.0 -18.92 0.11 -27.64 -1.41 0.85 -24.53 -51.67 -18.75 0.12 -38.78 -15.36 0.17 168.03 6.5 -19.43 0.11 -45.02 -1.47 0.84 -39.56 -49.50 -19.10 0.11 -63.22 -14.55 0.19 152.55 9.0 -20.57 0.09 -64.07 -1.56 0.84 -55.13 -46.87 -19.72 0.10 15.79 -14.28 0.19 136.68 11.5 -21.85 0.08 -2.59 -1.62 0.83 -71.03 -44.71 -20.91 0.09 243.63 -13.84 0.20 121.81 14.0 -23.10 0.07 258.44 -1.74 0.82 -29.63 -42.30 -22.41 0.08 217.48 -13.53 0.21 106.44 16.5 -24.05 0.06 235.82 -1.88 0.81 258.60 -41.74 -24.17 0.06 179.74 -12.95 0.23 92.94 19.0 -24.59 0.06 224.56 -1.99 0.80 242.13 -37.07 -27.09 0.04 133.20 -12.76 0.23 74.01 21.5 -25.42 0.05 206.39 -2.10 0.79 227.84 -40.39 -28.85 0.04 68.10 -13.12 0.22 68.84 24.0 -24.66 0.06 209.77 -2.10 0.78 209.72 -34.46 -24.31 0.06 6.26 -12.11 0.25 54.32 26.5 -21.90 0.08 223.86 -2.39 0.76 191.82 -31.38 -19.43 0.11 -33.31 -12.03 0.25 38.26 note: 1. three-port-wafer-probed data: port 1 = rf input, port 2 = selected rf output (i.e., on throw), and port 3 = unselected rf output (i.e., off throw).
4 rf out1 rf out2 rf in sel1 sel2 figure 1. HMMC-2027 schematic. recommended operating conditions, t a =25 c select line rf path rf in to rf in to sel1 sel2 rf out1 rf out2 -10 v 0 v isolated low loss 0 v -10 v low loss isolated
5 HMMC-2027 typical performance notes: 1. data obtained from wafer-probed measurements. 2. all compression and harmonic data measured on individual device mounted in an hp83040 series modular microcircuit package @ t case = 25 c. 3. harmonic data points below -80 dbc are at or near the noise floor of the measurement system. 0.045 26.5 frequency (ghz) figure 2. insertion loss [1] vs. frequency. -5 -3 -4 -2 -1 0 0.045 26.5 -100 -60 -80 -40 -20 0 insertion loss (db) figure 5. output return loss [1] vs. frequency. frequency (ghz) figure 3. input-to-output isolation [1] vs. frequency. isolation (db) figure 4. input return loss [1] vs. frequency. 0.045 26.5 -40 -24 -32 -16 -8 0 frequency (ghz) input return loss (db) s 21 s 31 s 11 0.045 26.5 -30 -18 -24 -12 -6 0 frequency (ghz) output return loss (db) figure 6. gain compression [2] vs. power input. 17 21 27 25 23 19 -5 -3 -4 -2 -1 0 power input (dbm) gain compression (db) s 33 s 22 3 ghz 1 ghz 300 mhz 100 mhz 50 mhz figure 7. harmonics vs. fundamental frequency [2,3] . 0 2 7 6 3 1 -90 -70 -80 -60 -50 fundamental frequency (ghz) harmonics (dbc) 5 4 second third p in = 5 dbm
this data sheet contains a variety of typical and guaranteed performance data. the information supplied should not be interpreted as a complete list of circuit specifica- tions. in this data sheet the term typical refers to the 50th percentile performance. for additional information contact your local agilent sales representative. note: all compression data measured in an individual device mounted in an hp83040 series modular microcircuit package @ t case = 25 c. figure 8. HMMC-2027 bonding pad locations. (dimensions in micrometers) 450 70 375 830 0 70 0 740 900 960 rf in rf out2 chip id 740 rf out1 sel1 sel2 525 www.semiconductor.agilent.com data subject to change. copyright ? 1999 agilent technologies 5965-5450e (11/99)
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